2020
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07
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17
1.半導體(ti)(ti)離(li)子(zi)(zi)束刻(ke)(ke)(ke)蝕(shi)(shi)機(ji)(ji)的(de)(de)組(zu)成(cheng) 離(li)子(zi)(zi)束刻(ke)(ke)(ke)蝕(shi)(shi)機(ji)(ji)由(you)真(zhen)(zhen)(zhen)空(kong)(kong)室(shi)(shi)、工(gong)(gong)作(zuo)臺(tai)、快(kuai)門、真(zhen)(zhen)(zhen)空(kong)(kong)抽氣(qi)系(xi)(xi)統(tong)(tong)(tong)、供(gong)(gong)氣(qi)系(xi)(xi)統(tong)(tong)(tong)、水冷系(xi)(xi)統(tong)(tong)(tong)、電(dian)源(yuan)和(he) 電(dian)器系(xi)(xi)統(tong)(tong)(tong)等主要(yao)部分(fen)(fen)組(zu)成(cheng)。該機(ji)(ji)在(zai)(zai)正常工(gong)(gong)作(zuo)時(shi),首先將真(zhen)(zhen)(zhen)空(kong)(kong)室(shi)(shi)的(de)(de)壓(ya)力抽至2×10-3Pa或(huo)更低,再調(diao)節Ar氣(qi)流量,使(shi)真(zhen)(zhen)(zhen)空(kong)(kong)室(shi)(shi)壓(ya)力保持 在(zai)(zai)1×10-2~2×10-2Pa(如需要(yao)輔助氣(qi)體(ti)(ti),如O2、CH2等,則可按一定比例(li)與之混合), 然后啟動離(li)子(zi)(zi)源(yuan)各電(dian)源(yuan),使(shi)離(li)子(zi)(zi)源(yuan)正常工(gong)(gong)作(zuo),從離(li)子(zi)(zi)源(yuan)引出一定能量和(he)密度的(de)(de)離(li)子(zi)(zi)束被(bei)中(zhong)和(he)器發(fa)射的(de)(de)電(dian)子(zi)(zi)中(zhong)和(he)后,轟(hong)擊工(gong)(gong)件進(jin)行(xing)(xing)濺射刻(ke)(ke)(ke)蝕(shi)(shi)。工(gong)(gong)件表面必須預(yu)先制備溝(gou)槽(cao)的(de)(de)掩(yan)膜圖形(xing)。這樣裸(luo)露部分(fen)(fen)被(bei)刻(ke)(ke)(ke)蝕(shi)(shi)掉,掩(yan)蔽部分(fen)(fen)被(bei)保留下(xia)來,從而在(zai)(zai)工(gong)(gong)件表面形(xing)成(cheng)所需要(yao)的(de)(de)溝(gou)槽(cao)圖形(xing)。 2.真(zhen)(zhen)(zhen)空(kong)(kong)系(xi)(xi)統(tong)(tong)(tong) 真(zhen)(zhen)(zhen)空(kong)(kong)系(xi)(xi)統(tong)(tong)(tong)有(you)兩套,分(fen)(fen)別用(yong)(yong)于預(yu)真(zhen)(zhen)(zhen)空(kong)(kong)室(shi)(shi)和(he)刻(ke)(ke)(ke)蝕(shi)(shi)腔體(ti)(ti)。預(yu)真(zhen)(zhen)(zhen)空(kong)(kong)室(shi)(shi)由(you)機(ji)(ji)械(xie)泵(beng)(beng)單獨抽真(zhen)(zhen)(zhen)空(kong)(kong),只有(you)在(zai)(zai)預(yu)真(zhen)(zhen)(zhen)空(kong)(kong)室(shi)(shi)真(zhen)(zhen)(zhen)空(kong)(kong)度達到(dao)設定值時(shi),才能打開(kai)隔離(li)門,進(jin)行(xing)(xing)傳(chuan)送片(pian)。刻(ke)(ke)(ke)蝕(shi)(shi)腔體(ti)(ti)的(de)(de)真(zhen)(zhen)(zhen)空(kong)(kong)由(you)機(ji)(ji)械(xie)泵(beng)(beng)和(he)分(fen)(fen)子(zi)(zi)泵(beng)(beng)共同(tong)提(ti)供(gong)(gong),刻(ke)(ke)(ke)蝕(shi)(shi)腔體(ti)(ti)反應(ying)生成(cheng)的(de)(de)氣(qi)體(ti)(ti)也由(you)真(zhen)(zhen)(zhen)空(kong)(kong)系(xi)(xi)統(tong)(tong)(tong)排空(kong)(kong)。 離(li)子(zi)(zi)刻(ke)(ke)(ke)蝕(shi)(shi)機(ji)(ji)真(zhen)(zhen)(zhen)空(kong)(kong)泵(beng)(beng)-阿(a)特拉斯真(zhen)(zhen)(zhen)空(kong)(kong)泵(beng)(beng) 型號:單級旋片(pian)泵(beng)(beng)GVS系(xi)(xi)列, 技術參數: 主要(yao)特點: 1.半導體(ti)(ti)工(gong)(gong)業(ye)用(yong)(yong)真(zhen)(zhen)(zhen)空(kong)(kong)泵(beng)(beng)和(he)系(xi)(xi)統(tong)(tong)(tong). 2.科(ke)研儀器,真(zhen)(zhen)(zhen)空(kong)(kong)加工(gong)(gong)用(yong)(yong)途真(zhen)(zhen)(zhen)空(kong)(kong)泵(beng)(beng)和(he)系(xi)(xi)統(tong)(tong)(tong). 3.排氣(qi)控制.污(wu)水處理系(xi)(xi)統(tong)(tong)(tong),氣(qi)體(ti)(ti)處理系(xi)(xi)統(tong)(tong)(tong). 4.油封旋片(pian)泵(beng)(beng).產品應(ying)用(yong)(yong)領域(yu):PCB板(ban)業(ye),半導體(ti)(ti)行(xing)(xing)業(ye),CCL行(xing)(xing)業(ye),SMT行(xing)(xing)業(ye),光電(dian)機(ji)(ji)械(xie),化(hua)工(gong)(gong)行(xing)(xing)業(ye)等。